The Next Era for Chiplet Innovation

Moore's Law is slowing down and the associated costs are simultaneously increasing. These pressures have given rise to new approaches utilizing advanced packaging and integration such as chiplets, interposers, and $3\mathrm{D}$ stacking. We first describe the key technology drivers and constraints that motivate chiplet-based architectures, exploring several product case studies to highlight how different chiplet strategies have been developed to address different design objectives. We detail multiple generations of chiplet-based CPU architectures as well as the recent addition of $3\mathrm{D}$ stacking options to further enhance processor capabilities. Across the industry, we are still collectively in the relatively early days of advanced packaging and 3D integration. As silicon scaling only gets more challenging and expensive while demand for computation continues to soar, we anticipate the transition to a new generation of chiplet architectures that utilize increasing combinations of 2D, 2.5D, and 3D integration and packaging technologies to continue to deliver compelling SoC solutions. However, this next era for chiplet innovation will face a variety of challenges. We will explore many of these technical topics, which in turn provide rich research opportunities for the community to explore and innovate.