Scaling Heterogenous Integration from Dies to Materials

Heterogeneous Integration is rapidly evolving in scale of connection pitches going from several micrometer pitches down to nm type pitches, allowing us to do near monolithic 3-D integration and even making the possibility of heterogenous materials integration a possibility. In this talk, we will explore the space of this connection pitch scaling and the functional enhancements that this kind of scaling can achieve. Specifically, we will describe lithographic (versus mechanical) alignment schemes for inter-strata interconnects. Finally we will explore the application of these methods to heterogeneous wafer engineering.