Clampless and Springless Pressure Mounted Semiconductor Power Module - Part II

Since writing our first presentation (1)on a unique power module, the PRIME-PAK™, several new advantages surfaced and new applications have been found. The performance of this module in actual field applications confirmed our calculations and predictions. Investigation is continuing to reduce manufacturing costs when produced in high volume without losing any of the original and the newly found advantages. The PRIME-PAK™construction offers: 1. Double sided cooling of the wafer(s) without the use of ceramic, glass, or beryllium oxide. 2. Possibility of mounting any type of semiconductor device, such as: diode, thryistor, transistor, darlington, GTO, ASCR, etc., with no limitation on the size of the device. 3. Built-in solid, simplified internal connections. 4. Heavy, solid terminals to connect appropriate size power leads to the external circuit. 5. Adaptability to a simplified, safe, efficient, isolated water cooling system. The paper high lights the electrical, thermal, and mechanical properties of the PRIME-PAK™ and points out the advantages in certain applications. (1)Motorcon '81, Chicago, June 1981.