Reliability assessment of flipchip on build up laminate based multi-chip package

A high performance multi-chip package with /spl sim/1300 I/O have been developed. This prototype package uses a build up (BU) laminate substrate with laser-drilled blind vias to provide the high density interconnections for substrate level integration as well as high I/O routing for the 2nd level interconnection to the PCB. Chip to substrate interconnection is by means of flipchip bonding and BGA solder ball for board attach. This paper describes the initial evaluation of reliability testing for the package with emphasis on microvia interconnection reliability and discusses the failure modes encountered with the multi-chip package.