Hardware Optimization of Current Distribution for Parallel-Connected, High-Power, Press-Pack IGBTs

IGBT modules are highly popular for high-power applications, but their finite current limit and expanding power requirements mean that methods for efficiently paralleling multiple modules is gaining attention. Press-Pack IGBT modules are ideal solutions for high-power applications, such as high-voltage DC and flexible AC transmission systems, due to their explosion-proof packaging, stable short-circuit failure mode, and their elimination of bond wires. However, accurate current sharing among paralleled IGBTs presents a significant challenge to the adoption of a parallel-module approach. To achieve balanced current distribution, optimization of the mechanical arrangement of parallel modules is critical. This work describes hardware optimization for Press-Pack paralleled IGBTs, and the results that can be obtained from correct mechanical layout. Power Integrations’ 1SP0340 single-channel SCALE(TM)-2 gate drivers are used for driving 4.5 kV IGBTs in parallel. Direct paralleling of IGBTs is supported by the 1SP0340 gate drivers. The P5000ZL45X202 and 5SMA 5000L450300 modules from Infineon Bipolar and Hitachi Energy are used to demonstrate performance.