Analysis on the Component Movement in Electronic Assembly

During the Pick and Place (P&P) and reflow processes associated with Surface Mount Technology (SMT), components mounted on solder paste may shift from their ideal position. Component movement is typically ignored during P&p, while movement occurring during reflow is referred to as self-alignment. The simulation and prediction of component movement in P&P and reflow processes are investigated in this paper using a mathematical model, machine learning prediction, and software simulation. The results indicate that displacement cannot be ignored during the P&P process. In addition, the volume of solder paste, the placement position of components, and the type of components all have a significant effect on component displacement. Support vector regression (SVR) is used to simulate and predict component displacement during the P&P process, whereas random forest regression (RFR) and the Surface Evolver are used to simulate and predict component displacement during the reflow process. These simulations exhibit satisfactory results.