High Density Interconnection Structure Based on Rigid-Flex Substrate for Conformal Application

In this paper, a high density interconnection structure based on rigid-flex substrate for conformal application is proposed. The proposed structure not only earns advantages of multi-layer rigid circuit board with low loss and high circuit routing density. But also gets easily mechanical bending performance while remaining excellent microwave signal transmission performance. And it keeps an integrated circuit board and ground plane that ensures high performances of low insertion loss, signal integrity and low cost. In order to verify the effectiveness of the proposed design, a prototype is fabricated and measured. It provides a good interconnection solution for conformal applications especially at microwave frequency band.