Increasing the Lifetime of the Implantable Neural Devices

Brain implants with complex three-dimensional geometries, like the Utah electrode array (UEA), provide a challenge for current encapsulation techniques. Parylene-C has been the gold standard for encapsulation of neural and biomedical implants to its well-suited combination of biocompatibility, electrical properties, and chemical inertness. However recording capabilities of long-term neural implants (> 6 months) encapsulated with Parylene-C show signs of degradation. To address this problem, we propose to develop and evaluate performance of a new silicon carbide (SiC) encapsulation material designed to extend the long-term stability and implantable lifetime in line with lifetime expectations for conventional cochlear implant electrodes.