Substrate-Integrated Waveguide Filtering Crossover Based on 3-D Assembly

A novel substrate-integrated waveguide (SIW) filtering crossover based on 3-D assembly is proposed, for the first time. The degenerate orthogonality of the TE102 mode and TE201 mode is fully utilized to obtain good cross-transmission and interchannel isolation. In addition, four resonant printed circuit boards (PCBs) are spliced and assembled like building blocks, successfully achieving energy transmission at different heights. The combined application of
$E$
-plane and
$H$
-plane is realized in filtering crossover design, for the first time. A
$K$
-band prototype is designed, fabricated, and measured to validate the proposal. Good consistency is demonstrated between the simulated results and the measured ones.