New halogen-free laminate for advanced package substrate

Nowadays, the demand for the printed wiring board (PWB) of the environment harmony type is rising rapidly. We have developed a new halogen-free material with low coefficients of thermal expansion (CTE), which will be applied to the plastic packages such as FC-BGA and CSP. The original resin system and filler treatment technique named FICS (Filler Interphase Control system) were applied to the material [1–3].