A transceiver module for quad band EGPRS (GSM/GPRS/EDGE) class 12 applications

This paper describes the design, technology selection and performance of a compact mixed signal transceiver module for wireless quad band EGPRS applications. The module uses 6 layers of HDI-organic substrate, integrates three IC technologies - 0.18 /spl mu/m RF-CMOS for RF/Analog, 0.13 /spl mu/m CMOS for mixed signal analog/digital/DSP and GaAs for an integrated passive devices (IPD) quad band balun - plus surface mount devices (SMD) for loop filter and RF bypass. It has the complete transmit line up from digital bits (as per DigRF standard version 1.1) to power amplifier interface, as well as receive function from LNA inputs to bits (per DigRF standard).