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IEEE Transactions on Electronics Packaging Manufacturing

Issue 4 • Oct. 2008

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Displaying Results 1 - 18 of 18
  • Table of contents

    Publication Year: 2008, Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2008, Page(s): C2
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  • In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

    Publication Year: 2008, Page(s):273 - 284
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1735 KB) | HTML iconHTML

    Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternativ... View full abstract»

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  • Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

    Publication Year: 2008, Page(s):285 - 290
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1310 KB) | HTML iconHTML

    Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape and Au bumps on a driver IC chip to form electrical paths. With the newly developed film carrier assembly technology, called chip on film (COF), the bumps are prepared separately on a film tape substrate and bonded on the finger lead ends beforehand; therefore, the assembly of IC chips can be mad... View full abstract»

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  • Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process

    Publication Year: 2008, Page(s):291 - 296
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2930 KB) | HTML iconHTML

    In this paper, silver powders with a uniform particle size of 0.2-0.4 mum and an excellent dispersibility were applied to produce a conductive ink for the inkjet printing process. The thermal behaviors of silver particles sintered at different temperature were investigated through X-ray diffraction (XRD) patterns. It was found out that both the particle size and crystal grains increase during the ... View full abstract»

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  • Void Formation Study of Flip Chip in Package Using No-Flow Underfill

    Publication Year: 2008, Page(s):297 - 305
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1588 KB) | HTML iconHTML

    The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch interconnect applications presents challenges for an assembly process that must achieve high electrical interconnect yield and high reliability performance. With respect to high reliability, the voids formed in the underfill between solder bumps or inside the solder bumps during th... View full abstract»

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  • 3-D Measurement of Solder Paste Using Two-Step Phase Shift Profilometry

    Publication Year: 2008, Page(s):306 - 315
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1482 KB) | HTML iconHTML

    A two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are pi-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the four-step phase shift profilometry (4-step PSP). In Fourier transform profilometry (FT... View full abstract»

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  • Automatic Microassembly Using Visual Servo Control

    Publication Year: 2008, Page(s):316 - 325
    Cited by:  Papers (25)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4505 KB) | HTML iconHTML

    We propose an automatic microassembly method that can be used to construct three-dimensional microelectromechanical system (MEMS) structures. A six degree-of-freedom micromanipulator, equipped with a passive microgripper, is employed to grasp, manipulate, and join the micropart using visual feedback from an optical microscope. The proposed process utilizes a two-stage alignment strategy to perform... View full abstract»

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  • Selecting an E-Scrap Reverse Production System Design Considering Multicriteria and Uncertainty

    Publication Year: 2008, Page(s):326 - 332
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (411 KB) | HTML iconHTML

    A reverse logistics and production network that deals with recycled material flows has become essential due to the growing concern about the environmental impact of disposed waste and the economic value of recovered materials. Reverse logistics infrastructure design is typically based on tradeoffs between different criteria and faces challenges posed by uncertain system parameters such as the reus... View full abstract»

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  • Bed of Nails—100- \mu m-Pitch Wafer-Level Interconnections Process

    Publication Year: 2008, Page(s):333 - 340
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2413 KB) | HTML iconHTML

    The rapid advances in integrated chip (IC) design and fabrication continue to challenge electronic packaging technology, in terms of fine pitch, high performance, low cost, and reliability. Demand for higher input/output (I/O) count per IC chip increases as the IC chip fabrication technology is continuously moving towards nano ICs with feature size less than 90 nm. As micro systems continue to mov... View full abstract»

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  • Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill

    Publication Year: 2008, Page(s):341 - 354
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (7444 KB) | HTML iconHTML

    Interconnect technologies between ICs and packages or boards have a significant impact on the IC performance and packaging density. Today, the interconnections are typically accomplished with either wire bonding or flip-chip solders. While both of these technologies are incremental, they also run into either electrical or mechanical barriers as they are extended to higher density of interconnectio... View full abstract»

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  • List of reviewers

    Publication Year: 2008, Page(s): 355
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  • Table of contents

    Publication Year: 2008, Page(s):356 - 357
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  • Table of contents

    Publication Year: 2008, Page(s):358 - 359
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  • 2008 Index IEEE Transactions on Electronics Packaging Manufacturing Vol. 31

    Publication Year: 2008, Page(s):360 - 366
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  • IEEE copyright form

    Publication Year: 2008, Page(s):367 - 368
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  • IEEE Components, Packaging, and Manufacturing Technology Society information for authors

    Publication Year: 2008, Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2008, Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University