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IEEE Transactions on Parts, Hybrids, and Packaging

Issue 3 • September 1975

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Displaying Results 1 - 15 of 15
  • Who's Who in G-PHP

    Publication Year: 1975, Page(s): 170
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  • Foreword

    Publication Year: 1975, Page(s): 171
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (66 KB)

    Summary form only given, as follows. This issue of the IEEE Transactions on Parts, Hybrids, and Packaging is the fourth annual issue that will be devoted to papers that have been selected from those presented at the 1975 Electronic Components Conference. The Conference is sponsored by the Parts, Hybrids, and Packaging Group and by the Electronic Industries Association. It is held each May and took... View full abstract»

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  • Stability Analysis of Laser Trimmed Thin Film Resistors

    Publication Year: 1975, Page(s):172 - 177
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (760 KB)

    Laser trimmed tantalum nitride thin film resistors age at a greater rate than untrimmed films. The high energy required to vaporize material in the cut, or' kerf, modifies the aging characteristics of film contiguous to the kerf. This undesirable feature could be mitigated if a design procedure were available to assure that end of life tolerances were manageable. In this paper a r. model is develo... View full abstract»

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  • High Pulse Power Failure of Discrete Resistors

    Publication Year: 1975, Page(s):225 - 229
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    Theoretical and experimental studies have been conducted on discrete resistors to determine the; power required to cause failure as a function of pulse width over the range 1µs to 10 ms. Single pulses of increasing amplitude were applied until voltage breakdown occurred, the resistor shattered, or until a resistance change of 5% or more took place. Carbon composition (both slug and film type)... View full abstract»

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  • Connecting Devices for Electronic Systems-Some General Design Considerations

    Publication Year: 1975, Page(s):212 - 215
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    The use of Rent's rule in assessing the economic trade-offs in partitioning electronic systems into larger or smaller units is described. The impact of this assessment on the size and number of connectors required is presented, The roles of non-separable (splicing) and separable (plug.in) connectors are discussed. A qualification procedure to assure reliability of non-separable connectors and curr... View full abstract»

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  • Effect of Surface Contamination on the Thermocompression Bondability of Gold

    Publication Year: 1975, Page(s):206 - 211
    Cited by:  Papers (43)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1080 KB)

    The recent development of a microshear test has made possible the quantitative study of the effect of surface contamination on thermocompression ball bonding of gold to gold metallization. Contarninant films were characterized by Auger electron spectroscopy and low energy ion spectroscopy. The thermocompression gold bonding process was found to be highly temperature dependent when organic films, w... View full abstract»

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  • Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated Aging

    Publication Year: 1975, Page(s):202 - 205
    Cited by:  Papers (22)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (856 KB)

    The strengths of thermocompression bonds made between gold plated copper lead frames and gold metallized thin film circuits decrease in time when aged at 200-300°C in air or vacuum unless there is a diffusion barrier (such as nickel) between the copper and gold. After pulling bonds to destruction, failure modes and failed surfaces were characterized by scanning electron microscopy, Auger spec... View full abstract»

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  • The Relationship Between Reliability and Bonding Techniques in Hybrid Systems

    Publication Year: 1975, Page(s):195 - 201
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (976 KB)

    Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate... View full abstract»

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  • The Effect of Heat Treatment on the Resistivity of Polycrystalline Silicon Films

    Publication Year: 1975, Page(s):239 - 240
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (232 KB)

    The resistivity of doped polycrystalline silicon films has been studied as a function of post deposition heat treatments in an oxidizing atmosphere. It was found that a short oxidation cycle may produce a resistivity increase as large as three orders of magnitude in the polycrystalline films. The extent of change was dependent on the initial resistivity and the films' doping level and was independ... View full abstract»

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  • A Multicoat Non-Burnable Protection System for Electrical Elements

    Publication Year: 1975, Page(s):235 - 238
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (456 KB)

    An approach to the problem of the non-ignitable and moisture resistant protective coating for electrical elements that use a double layer of coating composed of two different materials was investigated. The two materials are different in terms of the protection which they provide to the element. The first coating is truly non-burnable, inert, and is permeable to moisture, while the second coating ... View full abstract»

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  • Scanning Micro-Spot Auger Spectroscopy Study of Interdiffusion and Eutectic Formation in W-Pt-W-Au Thin Films

    Publication Year: 1975, Page(s):229 - 235
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1344 KB)

    Reactions in rf sputtered W-Pt-W-A,u films on oxidized and unoxidized Si substrates have been analyzed using a micro-spot scanning Auger spectroscopy and microscopy technique. The analysis shows that the W-Pt-W-Au films on Si substrates have undergone three annealing stages resulting in gold-silicon eutectic formation and migration. Stage I (450°C, 12 hours) was characterized by the formation... View full abstract»

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  • A New Method for Current Transformer Loading

    Publication Year: 1975, Page(s):221 - 225
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    The concept of using separate load and output windings on small current transformers offers properties which may be useful in many applications. The principle feature of this method is that the resistance of the load winding itself serves as the entire load for the device. Several means of achieving such a configuration are suggested, including the use of bifilar windings and single-turn load wind... View full abstract»

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  • Calculations for Leak Rates of Hermetic Packages

    Publication Year: 1975, Page(s):177 - 189
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2072 KB)

    An analysis is presented of the dependence of leak rates on geometry and flow mechanism. A combined-flow equation, valid for viscous, molecular, and diffusional flow is applied to capillary leaks and the results are extended to crack-shaped leaks and orifices. It is shown that for a given leak rate the geometry with the largest viscous contribution to flow is a single long capillary. A distinction... View full abstract»

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  • Gold Connector Contacts: Developments in the Search for Alternate Materials

    Publication Year: 1975, Page(s):216 - 220
    Cited by:  Papers (17)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (848 KB)

    The characteristics of electroplated and wrought gold-based contact materials for high reliability connectors in low energy circuit applications are reviewed. To insure that contacts do not degrade by film formation due to corrosion, diffusion, or wear processes, certain practices have evolved on the compositions, 'thicknesses, porosities, hardnesses and manufacturing methods for the golds, and fo... View full abstract»

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  • Reactively Bonded Thin-Film Conductors, a New Component for Combination Thin- and Thick-Film Technology

    Publication Year: 1975, Page(s):190 - 194
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1576 KB)

    A 'thin-film reactively bonded gold alloy has been developed. This material is similar in composition and physical properties to thick-film reactively bonded golds. It is a vacuum-deposited material that is fired in air at high temperatures (1000°C) to form a strong bond with ceramic substrates. Thin-film reactively bonded gold is a dense, smooth rhaterial with high electrical conductivity. T... View full abstract»

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Aims & Scope

This Transaction ceased production in 1977. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope