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IEEE Transactions on Semiconductor Manufacturing

Issue 3 • Aug 1988

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Displaying Results 1 - 4 of 4
  • Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven

    Publication Year: 1988, Page(s):105 - 114
    Cited by:  Papers (144)  |  Patents (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (856 KB)

    Results are presented from studies of heat transfer in a rapid thermal processing (RTP)-type oven used for several semiconductor wafer processes. These processes include: (1) rapid thermal annealing; (2) thermal gradient zone melting; and (3) lateral epitaxial growth over oxide. The heat transfer studies include the measurement of convective heat transfer in a similar apparatus, and the developmen... View full abstract»

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  • Contrast tuning, image reversal, and automated track developing

    Publication Year: 1988, Page(s):98 - 104
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1000 KB)

    An experiment was conducted to determine if contrast tuning could be performed on an automated track developer using a standard spray versus an ultrasonic nozzle. GaAs wafers were patterned with a linear variable neutral density filter (LVNDF) and developed by spray and an ultrasonic nozzle. The ultrasonic nozzle produced a lower chemical contrast than the standard spray development. This lower ch... View full abstract»

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  • Simulation of focus effects in photolithography

    Publication Year: 1988, Page(s):85 - 97
    Cited by:  Papers (14)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (996 KB)

    A simple physical model is proposed for bulk imaging effects during latent image formation in a resist layer. The model considers refraction at the air-resist interface, as well as depthwise defocus of the lateral intensity distribution within the resist layer. The approach represents a first-order correction to the vertical propagation model used in conventional photolithography simulation, yet p... View full abstract»

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  • Scheduling semiconductor wafer fabrication

    Publication Year: 1988, Page(s):115 - 130
    Cited by:  Papers (376)  |  Patents (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1347 KB)

    The impact that scheduling can have on the performance of semi-conductor wafer fabrication facilities is assessed. The performance measure considered is the mean throughput time (sometimes called cycle time, turnaround time or manufacturing interval) for a lot of wafers. A variety of input control and sequencing rules are evaluated using a simulation model of a representative, but fictitious, semi... View full abstract»

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Aims & Scope

The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components.

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Meet Our Editors

Editor-in-Chief

Anthony Muscat
Department of Chemical and Environmental Engineering
Harshbarger Bldg., Room 134
1133 E. James Rogers Way
University of Arizona
Tucson, AZ  85721