By Topic

2008 31st International Spring Seminar on Electronics Technology

7-11 May 2008

Filter Results

Displaying Results 1 - 25 of 141
  • [Front cover]

    Publication Year: 2008, Page(s): c1
    Request permission for commercial reuse | PDF file iconPDF (89 KB)
    Freely Available from IEEE
  • [Copyright notice]

    Publication Year: 2008, Page(s): c2
    Request permission for commercial reuse | PDF file iconPDF (45 KB)
    Freely Available from IEEE
  • Contents

    Publication Year: 2008, Page(s):i - vii
    Request permission for commercial reuse | PDF file iconPDF (51 KB)
    Freely Available from IEEE
  • Committees

    Publication Year: 2008, Page(s):viii - xi
    Request permission for commercial reuse | PDF file iconPDF (97 KB)
    Freely Available from IEEE
  • Authors index

    Publication Year: 2008, Page(s):1 - 3
    Request permission for commercial reuse | PDF file iconPDF (36 KB)
    Freely Available from IEEE
  • Reliability of electronics & photonics — Managing the time bomb

    Publication Year: 2008, Page(s):1 - 6
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (223 KB) | HTML iconHTML

    Survival and revenue maximisation result in pressures to cut costs and avoid adequate reliability tests. Serious errors also arise from ignorance about the reliability behaviour of manufactured products. Desk-based "simulations" alarmingly use theoretical text-book "data" to predict reliability and allow release of non-proven products. Some current reliability "standards" deliver a very poor calib... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The blocking leakage current of packaged silicon devices after their storage at 250 °C ambient temperature

    Publication Year: 2008, Page(s):7 - 12
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3453 KB) | HTML iconHTML

    Samples of commercial packaged silicon devices (diodes, thyristors, power MOSFETs) have been stored at 250degC ambient temperature for durations of 4 up to 100 hours. Comparisons of electrical characteristics measured before and after storage at this temperature revealed significant change in the level of the blocking leakage current for PN junctions with organic material passivation. The measured... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Influence of production technology to reliability of interconnections in the LTCC modules

    Publication Year: 2008, Page(s):13 - 16
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (257 KB) | HTML iconHTML

    The goal of this paper is to present an influence of chosen production technology on quality and reliability of printed interconnections in multilayer Low Temperature Cofired Ceramics modules and to predict some of their properties. This was achieved by the mutual comparison of testing samples which were based on two different technologies. The comparison was performed after accelerated testing un... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Life-time of lead-free soldered SMT joints

    Publication Year: 2008, Page(s):17 - 21
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (617 KB) | HTML iconHTML

    The work concern the life-time of electronic products according to ROHS Directive of European Community. Methods and results of accelerated mechanical and thermal cycling fatigue tests of SnPb and lead-free solder joints, realized in GreenRoSE EC Project are described. The aim of the work is development of cheap test methods, applicable by small producers of electronic equipment. Thermal shock cyc... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Ageing of semiconductor single crystals and metal-semiconductor junctions

    Publication Year: 2008, Page(s):22 - 24
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (633 KB) | HTML iconHTML

    CdTe radiation detectors resistance were periodically measured during long time interval with an applied voltage in range U=1 V to U=30 V. In 1.5 years of measurements we observed the aging of the homogenous semiconductor and metal-semiconductor junction. The resistance of the semiconductor increased significantly. The metal-semiconductor junction working in forward bias had much higher value of v... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Noise sources of p-type CdTe single crystal

    Publication Year: 2008, Page(s):25 - 27
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (200 KB) | HTML iconHTML

    We have carried out noise measurements of CdTe single crystals, prepared by Institute of Physics, Charles University in Prague. These crystals are used as radiation detectors. Three types of significant noise were observed: low frequency noise, generation-recombination noise and thermal noise. The sample had very high value of 1/f noise, much higher than theoretical estimation. The depleted layers... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Relaxation time in CdTe single crystals

    Publication Year: 2008, Page(s):28 - 31
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3220 KB) | HTML iconHTML

    Bulk resistance decay of two cadmium telluride single crystals was investigated. Each CdTe crystal has four golden contacts, two current contacts and two voltage contacts. That allows us to distinguish between bulk resistance and contact area. The bulk resistance of each CdTe single crystal was measured during long time interval with an applied voltage U = 16 V. Detectors were placed into a cryost... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors

    Publication Year: 2008, Page(s):32 - 36
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1357 KB) | HTML iconHTML

    In light of the RoHS-directive, that came into effect on July 1st 2006, lead free solders gained immensely in importance. The growth of the interfacial intermetallic compound layer between lead free solders and thick film metalizations was studied. A SnAg3.0Cu0.5-, a SnAg3.0Cu0.5Ni0.06Ge0.01- and a reactive-solder (SnCu1 + SnAg3.5 + Pd2) were tested on Ag-, Ag/Pd- and Ag/Pt-conductors. Samples wer... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Calculation of BGA contact resistance by using the contacts volume method

    Publication Year: 2008, Page(s):37 - 40
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (505 KB) | HTML iconHTML

    In Warsaw University of Technology was developed special BGA256r test specimen [1] for early failure detection during the reliability tests. The failures were detected by resistance measurement by four- point method. Before the reliability tests, the real, initial resistance values were measured. Proposed method of calculation BGA contacts initial resistance is useful for preparing FEA analysis, e... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Influence of mechanical stress and temperature aging on a change of electrical connection resistance

    Publication Year: 2008, Page(s):41 - 44
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1222 KB) | HTML iconHTML

    This article deals with the mechanical stress and the temperature aging of the lead and lead free soldered joints. Soldered joints have influence on a total quality of electronic assembly. Mechanical and temperature tests are mainly used for resistance evaluation of components, devices and whole products against stress. This stress takes effect during function, transport and storage of the devices... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Pulsed stress behavior of flexible thick film resistors

    Publication Year: 2008, Page(s):45 - 50
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (914 KB) | HTML iconHTML

    In order to investigate the behavior for very high current densities of polymer resistors on flexible substrates, a pulsed measurement technique was applied. The analytical test technique of Transmission Line Pulsing (TLP) allows, on the basis of square pulses, the in-situ monitoring of the voltages and currents at the Device Under Test (DUT) during pulsing and helps to gain fundamental insights i... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Behavior of temperature inside PN junction during microplasma switching

    Publication Year: 2008, Page(s):51 - 54
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (475 KB) | HTML iconHTML

    The contribution is focused on determination of a temperature inside PN junction defect regions. These defect regions are called microplasmas. The microplasma is specified like region with a lower strong-field avalanche ionization breakdown voltage than other homogenous PN junction regions. The existence of such regions may lead to local avalanche breakdowns occurring in reverse-biased PN junction... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Influence of PCBs coatings wettability on lead-free SMT solder joints reliability

    Publication Year: 2008, Page(s):55 - 60
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (356 KB) | HTML iconHTML

    The paper presents results of wettability study of PCBs with immersion Sn, Ni/Au and SnCu coatings before reflow soldering process. Furthermore the solder joints were made in the optimal lead-free reflow soldering conditions using chosen materials with different wettability value of PCBs coatings and their reliability assessment was executed. The results of investigations have shown that exist dir... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Life-time test of laser and reflow soldered flexible substrates

    Publication Year: 2008, Page(s):61 - 66
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (413 KB) | HTML iconHTML

    We examined the quality and the reliability of lead-free solder joints which were made with a selective laser soldering process. The three types of applied substrate materials - polyimide (PI), a kind of polyester (PET) and polyethylene-naphtalate (PEN) - withstood the local heat dose even if the allowed temperature limits of them were lower than the melting points of the applied solders. We used ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Predictive reliability and prognostics for electronic components: Current capabilities and future challenges

    Publication Year: 2008, Page(s):67 - 72
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (478 KB) | HTML iconHTML

    Future analysis tools that predict the behavior of electronic components, both during qualification testing and in-service lifetime assessment, will be very important in predicting product reliability and identifying when to undertake maintenance. This paper will discuss some of these techniques and illustrate these with examples. The paper will also discuss future challenges for these techniques. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Thick film resistor testing by electro — Ultrasonic spectroscopy with DC electric signal

    Publication Year: 2008, Page(s):73 - 76
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (236 KB) | HTML iconHTML

    The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Dielectric characteristics of composite systems

    Publication Year: 2008, Page(s):77 - 81
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (383 KB) | HTML iconHTML

    This paper deals with the dielectric and electric characteristics of a polymer - Ni composite. Permittivity (dielectric constant) and loss factor are analyzed as functions of frequency and filling factor, and internal resistivity as a function of the Ni filling factor. The analyzed system is the composite of the ethylene-vinyl-acetate copolymer with the Ni powder. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • New mixed rules

    Publication Year: 2008, Page(s):82 - 85
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (407 KB) | HTML iconHTML

    The paper studies dielectric properties of elastomer filled with Ni spherical particles of different sizes within the range 35-115 mum. The experimental analysis is followed by the examination permittivity/conductivity mixing rules. A new mixing formula for the composite system consisting of spherical metallic particles and polymer matrix is presented. This formula includes both Ni particle conten... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Dielectric relaxation in glycerol at long-time exposure to low temperatures

    Publication Year: 2008, Page(s):86 - 90
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (269 KB) | HTML iconHTML

    This paper deals with the dielectric relaxation in glycerol at different temperatures (down to 25 K) for protracted periods of time. Two relaxation maxima were observed. The peak at lower frequencies was ascribed to the relaxation alpha-process of glycerol proper; the peak at higher frequencies differed in samples from different manufacturers, so that it represents rather a relaxation peak associa... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Material characterization with the ultrasonic microscope

    Publication Year: 2008, Page(s):91 - 95
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB) | HTML iconHTML

    An effective method for material characterization with a scanning acoustic microscope (SAM) is presented. The elastic parameters Young's modulus and bulk modulus and the density are determined from one single reflection signal. In contrast to established methods a calibration specimen is not required. Additionally, the thickness of the specimen can be estimated with two reflection signals at diffe... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.