A new multichip module using a copper polyimide multilayer substrate

A new multichip module using a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors is presented. This substrate contains small copper columnar vias which reduce the thermal resistance of polyimide layers without causing a channel accommodation decrease, and thin-film resistors for terminated transmission. This module can densely mount high-speed LSI chips that produce twice as much heat as those in conventional modules. Furthermore, this module can transmit high-speed pulses at over 2 Gb/s.<
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