Improving manufacturing reliability in IC package assembly using FMEA technique

The author describes the basic potential failure mode and effect analysis (FMEA) technique and shows how the technique is useful in improving the manufacturing reliability and final quality of an IC package, and for complex packages and multichip module assemblies. The use of FMEA for improving the manufacturability and manufacturing reliability of packages by a systematic and quantified analysis of the package design and process is also discussed. A case study is discussed to demonstrate the importance and usefulness of the FMEA technique.<
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