Fault diagnosis and fault localisation in integrated circuit by thermal method

In the paper, a thermal testing method for integrated circuits (ICs) is presented. This method compares the real temperature field with the standard field, suitable for the specified energy state of the system. A method of temperature sensor placement strategy is presented as well. This placement method is proposed for fault diagnosis and fault localisation in ICs. An algorithm based on mutual dependencies of average temperatures of selected sub-areas of the IC in order to locate failure is described. Simulation results of the sensor placement strategy and fault diagnosis and localisation are presented. Statistical analyses of the yield of the testing method are shown.