Micromechanical measurement subsystem

The subsystem relates to control, testing and measurement instrumentation with closed digital control loop structure and may be used, in particular, for testing and measurement of smooth displacements resulting from, for example, force or temperature deformation of an object, or for detection of changes in geometric dimensions of an object while monitoring its air tightness, in particular, when monitoring air tightness of integrated microcircuits in cremate packages or water tightness of integrated circuits in a watertight case. Also it may be used with some additions for tactile sensing in robotic systems.