Overview for 300 mm foundry manufacturing

Five pilot or production Fabs were set up in the year 2000 to start 300 mm integration wafers. TSMC was one of them and had started a pilot production line in Fab 6, Tainan, Taiwan. After 300 mm tool installation in 3Q/00, TSMC had successfully completed 0.18 /spl mu/m, 0.15 /spl mu/m, and 0.13 /spl mu/m logic process transition from 200 mm to 300 mm. Also, great progress in 300 mm factory automation including wafer transportation, wafer container (Front Opening Unified Pod) management, recipe automatic download, and tool parameter control was obtained. This paper focuses on the progress in these two areas, 300 mm factory automation and 300 mm process technology transition for a 300 mm foundry manufacturing.