Gate oxide integrity on ITOX-SIMOX substrates and influence of test device geometry on characterization

The integrity of gate oxides on low-dose separation by implanted oxygen (SIMOX) substrates fabricated by the internal-thermal-oxidation (ITOX) process, so-called ITOX-SIMOX substrates, was evaluated, and the influence of test device geometry on the characterization was investigated. Characterization of time-dependent dielectric breakdown (TDDB) was performed for a gate oxide of 8.6-nm thick using lateral test devices. Experimental results show considerable influence of gate electrode geometry on the gate oxide integrity (GOI) characteristics. This can be explained by a model that includes a lateral parasitic resistance in the superficial Si layer beneath the gate electrode. Based on analysis using this model, a test device with a small gate array was proposed to reduce the influence of lateral parasitic resistance, and the advantage of the device was verified.