An influence factor of high reliable thermosonic au wire-bonding

Thermosonic bonding has been found to be a promising process in microelectronic packaging industry. It provides electrical interconnects between semi-conductor, hybrid, or microwave devices. Gold wire wedge bonding has been widely used in microwave communications and surveillance projects for its nicer high frequency characteristics. In this thesis, the roughness of the bonding tools tip as one of the factors which influence the bonding quality was presented. The mechanism and the results of experimentation were introduced in detail.