Using Die to chip carrier wire bond transition to build a 4th order differential LP filter for 10 Gpbs O/E receiver

We present in this paper a simple way to integrate a 4th order low pass filter (LPF) Bessel Thompson function with the help of the Die's wirebond attaches from a trans-impedance amplifier (TIA) Die in an opto-electrical receiver (O/E Rx). Additional RF distributed microstripline elements on the O/E Rx chip carrier substrate will complete the LPF topology. This way the die to chip carrier transition is fully embedded in the LPF structure, and eliminates the needs of an additional die and wirebond attaches for the LPF function.