Electro-thermal simulation of semiconductor devices and hybrid circuits

This works describes the use of electro-thermal numerical simulations for the design, modeling, and reliability evaluation of semiconductor devices and electronic circuits. Examples at the device level focus on 2D and 3D simulations of GaAs-based HFETs and HBTs, while a case study of hybrid high-power DC/DC converters is shown to illustrate the possibilities and challenges of thermal simulation at board level.