Border-Trap Characterization in High-$\kappa$ Strained-Si MOSFETs

In this letter, we focus on the border-trap characterization of TaN/HfO
₂
/Si and TaN/HfO
₂
/strained-Si/Si
_0.8
Ge
_0.2
n-channel MOSFET devices. The equivalent oxide thickness for the gate dielectrics is 2 nm. Drain-current hysteresis method is used to characterize the border traps, and it is found that border traps are higher in the case of high-kappa films on strained- Si/Si
_0.8
Ge
_0.2
.These results are also verified by the 1/f-noise measurements. Possible reasons for the degraded interface quality of high-kappa films on strained-Si are also proposed.