A Silicon Thermal Accelerometer Without Solid Proof Mass Using Porous Silicon Thermal Isolation

A Si thermal accelerometer without solid proof mass, based on porous silicon (PS) technology has been developed and characterized. The device is compatible with silicon technology and it consists of a polysilicon heater and two thermopiles, situated symmetrically on each side of a heater. A thick PS layer provides thermal isolation from the Si substrate. The operation principle is based on the movement induced thermal convection variations between the heater and the hot thermopile contacts, which are caused by the movement of the hot fluid medium on top of the heater with respect to the sensor die. A detailed simulation by the FEA package Ansys was carried out in order to find the optimum geometrical parameters and the theoretical device behavior. The porous silicon thermal accelerometer (PSTA) was tested in a specially designed vibration system for various frequencies and accelerations. Different packaging configurations were also evaluated for both air and oil surrounding environments. The dependence of the PSTA response on applied power was studied for each surrounding environment. In each case, the response was compared with a commercial reference accelerometer and the corresponding sensitivities were extracted.