Package Model for Efficient Simulation, Design, and Characterization of High Performance Electronic Systems

As bit rates are approaching 10 Gbps with ever-increasing requirement for package performance, multi-layer FC-BGA package are gradually becoming a de facto for high performance system. Since the signal frequency is now in the range of noise generated by power plane resonances, it presents a major challenge to model the complex interaction between signal traces and power/ground planes. Any attempt to segment the package into smaller pieces to simplify the computation may compromise the accuracy, diminishing the resonance effect. Conversely, full package model created from field solver is impractical and too expensive to generate. This paper presents a methodology to unify signal and power integrity into a single simulation model derived from conventional signal and power integrity models. The proposed method utilizes piece-wise modeling approach to dissect the package structures into component models and unify them into a single simulation circuit. The proposed approach can be extended to full system simulation, resulting in fast computation for design space exploration where massive simulations are necessary