Improvement of interfacial performance on silicone insulating and semiconducting interface by plasma-treatment

In this paper, we investigated the effects of short-term oxygen plasma treatment of semiconducting silicone layer to improve interfacial performances in joints made with silicone materials. Surface characterizations were assessed using contact angle measurement and XPS, and then adhesion level and electrical performance were evaluated from T-peel test and breakdown voltage between treated semi-conductive and insulating layer. From the results, the oxygen plasma treatment produces a significant decrease in surface energy, which can be mainly ascribed to the creation of oxidized groups on the silicone surface based on results using XPS. This facilitates to adhesion with only short term plasma treatment (/spl sim/ about 1 min.). Therefore, it is concluded that plasma treatment improve the adhesion in silicone interface and then decrease possibilities of voids formation.