Transient analysis of impact fracturing of solder joints

Numerical studies of transient fracturing of a package-level solder joint subjected to displacement-controlled impact loads are presented in this study. The explicit three-dimensional finite element analysis is incorporated with contact, fracturing and fragmentation mechanisms to predict transient structural responses and failure modes of the solder joint. Different strengths of the intermetallic compound, different impact velocities, and different impact angles are specified and corresponding structural responses and failure modes are investigated.