Latest development status of MAPPER

The MAPPER technology combines massively-parallel electrom-beam writing with highspeed optical data transport used in the telecommunication industry. The electron optics generates 13,000 electron beams that are focused on the wafer by electrostatic lens arrays. Each beam has its own optical column to avoid a central crossover. This secures high throughput (> 10 wafers per hour) at high resolution (< 45 nm). The 13,000 e-beams are generated by splitting up the electron beam that originates from a single electron source (see fig.1). The e-beams are arranged in such a way that they form a rectangular slit with a width of 26 mm, the same width as a field in an optical stepper. During exposure the e beams are deflected over 2 pm perpendicular to the wfer stage movement. This means that with one scan of the wafer a full field of 26 mm x 33 mm can be exposed. During the simultaneous scanning of the wafer and deflection of the electron beams the beams are switched on and off by 13,000 light signals, one for each abeam. The light beams are generated in a data system that contains the chip patterns in a bitmap format. This bitmap is divided over 13,000 data channels and streamed to the e-beams at 1-10 GHz.