Low-frequency noise measurement-based reliability testing of VLSI interconnects with different geometry

Low-frequency noise measurements were performed on thin metallic very large-scale integration (VLSI) interconnects of three different geometries. These measurements were carried out under stressing current densities between 1.0/spl times/10/sup 5/ A/cm/sup 2/ and 2.2/spl times/10/sup 6/ A/cm/sup 2/ at different ambient temperatures up to 280/spl deg/C, in order to investigate the dependence of low-frequency noise on the geometrical shape of the VLSI interconnects. The behavior of these samples under these conditions is analyzed in this letter.