RF SiP: the next wave for wireless system integration

This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.