Smart disassembly [joint separation method]

We propose a new joint part separation method. The new separation method is carried out at room temperature using a low melting point element such as gallium. The separation of the joint part was realized by liquid metal diffusion into the interface at room temperature. The joint part was separated easily because the element along the interface became liquid. The method was successfully demonstrated on joint parts of Al-Al, Al-sapphire and a soldered chip on a printed circuit board.