Comprehensive treatment of moisture induced failure-recent advances

This paper describes a comprehensive treatment of moisture induced failure in integrated circuit (IC) packaging with emphasis on recent advances. This includes advanced technique for modeling moisture diffusion under dynamic boundary conditions such as experienced by packages during solder reflow, autoclave, and temperature-humidity cycling; advanced characterization technique for moisture sorption and diffusion properties of packaging materials including effect of edge diffusion on transverse diffusivity, anisotropic diffusivity in organic laminates, impact of non-Fickian sorption; advanced techniques for modeling vapor pressure during solder reflow; advanced techniques for modeling dynamic delamination propagation during solder reflow; interfacial fracture strength as a function of temperature and moisture; as well as plastic analysis of popcorn cracking.