The Effect of Dual Ultrasonic-assisted Soldering Process on the Properties of Cu/40%Zn+60%SAC0307 Powder/Al Joint

In this paper, a mixed powder of 40%Zn+60%SAC0307 is used as the solder, and a new type process of dual ultrasonic-assisted soldering is used to achieve the interconnection of copper and aluminum dissimilar materials. By comparing the different positions of the ultrasonic vibrators act, it can be concluded that when ultrasonic waves are applied to the side of the hard-to-soldering base material (AI side) under the same ultrasonic power, the overall interconnection quality of the joint will be improved. At the same time, by comparing the difference in shear strength and microstructure of the joints obtained by dual ultrasonic and traditional single ultrasonic-assisted soldering, it is concluded that the soldering effect of the dual ultrasonic-assisted soldering process is more ideal. The Cu side forms an IMC layer of
${\text{Cu}_{5}\text{Zn}_{8}}$
, and an AI-Zn solid solution layer is formed on the Al side. The microstructure of the interface on both sides of the joint is uniform and smooth; meanwhile, there are no obvious defects. The shear strength of the joints obtained by the dual ultrasonic process can enhance about 18% compared with the single ultrasound, the average strength can reach 26.33MPa.