Synthesis and characterization of Ag-37at.%Cu solid solution nanoparticles for high reliability packaging

In this paper, Ag-Cu solid solution nanoparticles (ACSS-NPs) were prepared by liquid phase chemical reduction for high reliability packaging. On the one hand, the ACSS-NPs only with the lattice structure of Ag show excellent oxidation resistance. On the other hand, solute of Cu in Ag phase is expected to inhibit the electrochemical migration of Ag. The pressure sintering was used to prepare the Ag-Ag joints. The shear strength of the joints sintered at 295°C for 30 min under 20MPa, reaches 104.5 MPa, which satisfies the use requirements.