Signal Integrity Design and Analysis of High Bandwidth Memory on Silicon Interposer

In this paper, the signal integrity design and analysis of HBM channel on silicon interposer is presented. Firstly, the concept of silicon interposer integrated with HBM and GPU for high bandwidth system is introduced. Secondly, the detailed stack-up of silicon interposer based on copper damascene process is proposed. And the physical dimension and the material property of the proposed silicon interposer are also provided. Thirdly, a novel signal routing pattern in silicon interposer design is presented to alleviate the problem in terms of conductor loss and crosstalk so that the signal integrity of HBM interface can be improved. Finally, the electrical performance of the HBM interface is analyzed by simulation in the frequency and time domain. The simulation results show that the electrical performance of HBM channel can meet the target specification and the proposed routing pattern design is validated.