Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules

As a basic component of optical communication network, the speed of optical modules is evolving towards 56G bit/s, which brings a great challenge to the signal integrity of interconnect structures. At present, optical chip and PCB board or substrate are interconnected mainly through gold wire bonding. Gold wire bonding has the property of low pass. The compensation method is studied in this paper. It is confirmed that the inductive compensation after the capacitive compensation using low pass filter theory can improve the performance of the transmission line.