Low-Temperature Bonding of High-Power Device Using Cu-Ag Composite Nanoparticle Paste

In this work, a Cu-Ag composite nanoparticle paste was proposed for high-power packaging. The nanoparticle (15 nm) has good oxidation resistance and sintering performance. The effect of bonding temperature on the mechanical performance of Cu-Ag composite paste were researched. To explore the practicality of application as a die-bonding material, LED packaging with Cu-Ag nanoparticle paste was prepared and compared with traditional solders. The junction temperature and differential structure functions of LEDs were tested. LEDs with different die-bonding materials were aging for 100 h, and light output power is measured to compare the reliability.