A method of research for the reliability of solder joint shape

In this paper a method of research for the reliability of solder joint shapes is proposed. By using Surface Evolver software, finite element analysis, minimum energy principle and gradient descent method to calculate the minimum state of energy, the final shape of the solder joint is predicted. By studying the shape of SOP solder joints and using Surface Evolver software, the error between model parameters and slice parameters is finally less than ±10%, which reduces the error between device models and slices. The reliability and life of solder joints are more accurately predicted.