Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading

Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.