Study of adhesion for Cu/Ru(Zn) on dielectrics by an improved four-point bending measurement

An asymmetric sample preparation method was used in the four-point bending measurement. By using 304 stainless steel with good ductility as lower beam instead of brittle Si, the yield can be increased to more than 75%. It is found that by Ru(Zn) has very good adhesion with the dielectrics because of Zn cooperation. Formation of Zn silicate helps significantly improve the interface adhesion.