The Effect of Electrolytic Deflash Current on Delamination of Epoxy Mold Compound During Tin Plating Process

Microelectronic packages based on leadframes are commonly used in the semiconductor industry. The surface properties of the metal-based leadframe have an impact on the epoxy mold compound (EMC). When moisture is present in the package during the reflow operation, the force produced can cause the adhesion bonding between the EMC and leadframe to deteriorate, resulting in interfacial delamination. This paper discussed the effect of electrolytic deflash (ED) current on the delamination at leadframe and epoxy mold compound (EMC) interface during Sn plating process. Three variations of ED currents involved in this investigation, such as 0, 1 and 3 A, assess the impact of delamination at leadframe and EMC interface. The characterization of samples is subjected to C-SAM to check for delamination after preconditioning at 260°C. The results showed that increasing ED current resulting in a higher risk of delamination due to the electrolytic deflash effect from the C-SAM evaluation.