FOWLP AiP Optimization for Automotive Radar Applications

Fan-Out Wafer-Level-Packaging (FOWLP) that directly molds the bare die inside the package with the antenna fabricating on the package stands out a very elegant and compact solution for 77GHz MIMO radar. This paper presents the Long Range Radar (LRR) Antenna in Package (AiP) optimization to implement such MIMO radar. The chip and package AiP codesign issue that is great challenge for FOWLP AiP radar is presented and addressed in terms of Gain enhancement; The 2.3dB AiP Gain enhancement is achieved collectively by antenna optimization, passive circuit optimization and FOWLP mold material optimization; The final optimized LRR AiP performance feeding from chip is obtained with
$\vert \mathrm{S}11\vert < -10\text{dB}$
, 18dBi Gain and stable radiation patterns over the 77-81GHz; The material effect on the AiP gain performance is also studied thus providing guidance on the FOWLP material selection or innovation to further enhance AiP performance.