Analysis on Distortion of Fan-Out Panel Level Packages (FOPLP)

Panel distortion is an inevitable problem in the manufacturing of fan-out panel level packages (FOPLP). Panel distortion is defined as the maximum off-position of each unit from designed coordinate. We studied what caused the panel distortion in the manufacturing process of FOPLP and found that the panel distortion was mostly caused by the shear stress between the cavity frame core and the soft carrier in the soft carrier attach process. By reducing the shear stress, the panel distortion was remarkably improved to 40% of its original value. The effect of cavity frame core to the panel distortion was investigated, too. The cavity frame core is the unique feature of FOPLP of Samsung that can provide efficient front-side to back-side interconnection. By controlling the panel distortion under the desired value, the FOPLP of Samsung can have outstanding overlay capability, design flexibility, and productivity.