Electromagnetic Shielding Analysis of Different Grounded Bump Distribution in SiP

In this paper, a strategy for improving the electromagnetic shielding effectiveness of System-in-Package (SiP) by optimizing the distribution of grounded bumps is presented, where the full-wave simulation is applied to obtain electromagnetic radiation under different grounded bump distributions in SiP. The shielding performance of the package with different grounded bumps distributions is further analyzed. Then the gap between signal bumps and the ground plane is modeled as a rectangular waveguide. Moreover, the reason why the shielding performance of different model changes is explained. Finally, this paper draws a method to improve the overall shielding performance of the package. As a result, this work can guide the optimal design of Integrated Circuits (IC) package.