Design of Vapor Chamber as a Cooler for High Power Leds

In the high-power dissipation devices, the demand for thermal solutions has been increased over the period. Over time, heat sinks have been the most preferable thermal solution to many applications but are still limited to provide better thermal conductivity in high power applications. Instead vapor chambers provide even better thermal conductivity than copper. The thermal conductivity of copper is 231 Btu/hr-ft-F or 385 Watts/mk which is higher than all other metals except silver and diamond. In this paper, the latest vapor chamber design has been introduced using aluminum casing. The design structure uses a stack of 1mm fin plates connected to the vapor chamber in order to offer much better thermal conductivity. The thermal conductivity of aluminum is 235 Watts/mk which is less than copper but it is economical. The results of the thermally tested vapor chamber are added in this paper to provide a better understanding of the vapor chamber.