Edge and Dielectric Surface Roughness-Aware EM-RA Model for MLGNR Interconnects

This paper presents an edge roughness (ER) and dielectric surface roughness (DSR) - aware exponential matrix-rational approximation (EM-RA) model for the transient analysis of multi-layer graphene nanoribbon (MLGNR) interconnects. The proposed model analyzes the signal integrity in terms of the peak crosstalk and the propagation delay. The results obtained using the proposed ER and DSR - aware EM-RA model for the crosstalk and delay analysis are compared with the industry-standard SPICE simulator. The ER and DSR - aware EM-RA model results have excellent accuracy compared to HSPICE with less than 0.5% error. The proposed model provides a speed-up by a factor of 84.36 and 86.05 for carrying out the signal integrity analysis in coupled-two and coupled-three MLGNR interconnect lines, respectively, in comparison to HSPICE. The speed-up further increases with the more refined 2D ER and DSR grid of variations. The CPU memory efficacy of the proposed model is compared with HSPICE. The proposed model's stability is analyzed for a range of local to global interconnects.