Modelling Surface Topography in Ultra-Precision Grinding Process

Ultra-precision grinding is an often used manufacturing technology to achieve high surface quality of monocrystal silicon to satisfy severe requirements. However, the final ground surface is sensitive to the grinding conditions, such as the wheel type, processing parameters and the vibration, etc., which is not easy to systematacially research by experimental method. Since the material removal process is a comprehensive result of the interaction between grains and the workpiece surface, an analytical simulation method based on the grains trajectories of wheel is more efficient. Particularly, in ultra-precision grinding, the grains can achieve ductile removal mode under certain processing conditions, which means the final surface topography is much closer to the result of the simply interaction of grains trajectories. Thus, this work aims to develop a suitable numerical simulation method to generate ultra-precise surface topography. First, simulate the topological matrix model of the grinding wheel shape, and then generate the grain trajectory based on the movement relationship between the grinding wheel and the workpiece. Finally, the simulation results are compared with the experimental results from the surface topography, which proves the effectiveness of the analytical simulation method. This method in this work can be used to derive the best parameters for process conditions..