Calculations of Temperature Distributions for Power MMICs in 3-D Packages

3-D integrated circuits have high density devices and interconnections with the increasing of power density, therefore, the thermal management is important. This paper proposes an analytical solution which can calculate the temperature distributions of multiple layers structure. Based on the expansion of the Fourier series method, the iterative approximation calculation method is used to analytically determine the heat flux at each interface, which has shown close agreements with the results obtained by using finite element method.